Semi-Automatic Bonding Machine KBM-150
The bonding process can be performed with a single machine, enabling stable bonding!
In addition to various sizes (φ2 inches, φ3 inches, φ4 inches, φ6 inches), we can also manufacture multiple wafer bonding, such as one, three, or five pieces, according to customer requests. The bonding process is performed with a single machine, which includes (1) heating the carrier plate, (2) applying wax, (3) positioning the workpiece, (4) applying pressure, and (5) cooling, enabling stable bonding.
- Company：秀和工業
- Price：Other
